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Features: 1. High quality soldering flux with excellent performance. 2. Use without concerns - not corrosive to integrated circuit board. 3. Its boiling point is slightly higher than that of soldering tin. 4. Lightweight with small volume, easy and convenient to use. 5. Easy and durable soldering with this flux, as well as fast cleaning and good insulation. 6. Ideal for flux soldering in precision electronic product, PCB, BGA, etc.
Specifications: Mode;: UV50 Color: Yellow Viscosity: 0.2PaS Granularity: 0.22um Weight: Approx. 35g Instructions: 1. Wipe the surface of the object before soldering. 2. Apply the paste flux to the solder joint. 3. Solder the tin to the solder joint with soldering iron.